导师风采 Supervisor's Information

王琛任职于清华大学材料学院，担任副教授和博士生导师，同时兼任于北京集成电路高精尖中心，创建了清华大学NEXT Lab，入选一项国家级高层次青年人才计划（与杰青互斥）和两项国家青年人才计划。博士毕业于美国加州大学洛杉矶分校，曾在美国加州硅谷包括英特尔、泛林半导体等多个知名芯片公司负责高端芯片关键技术研发，从事了三代高性能计算和存储芯片的材料-工艺-设备研发、器件-集成-系统设计工作。当前从事基础半导体和集成技术学术研究，致力从芯片新材料与后摩尔芯片两个端口，多维度开展对新型半导体材料、下一代半导体工艺、新原理高性能器件、多源异质集成微系统和新一代芯片的系统性基础研究和融合性应用研究。近期在相关领域取得了一系列成果，发表在Nature, Science, Nature Electronics, Nature Nanotechnology, Chemical Society Reviews等高影响力论文，总引用超过10000余次，第一发明人的发明和PCT专利申请和授权10余项，参与国家标准和行业标准制定3项，出版书籍章节1章，合译专著2部，是国家四十五重点出版物《先进芯片材料与后摩尔芯片技术丛书》执行主编。近期主持自然基金委、科技部重点研发计划课题、北京市科委重大专项等11项国家和重点企业基础研究项目等。目前担任中国电子学会半导体与集成分会委员，中国发明协会理事，国家纳米技术标准化委通讯委员、中国国际半导体技术大会委员会常任委员（CSTIC）、SmartMat、Precision Chemistry, Nano Micro Letters, Frontier of Physics、Journal of Materials Science and Engineering等青年编委，担任 IEEE NANO、全国集成微系统建模与仿真大会等多个国际国内行业会议的分会场主席。曾获英国皇家化学会Horizon Prize-Materials Chemistry Stephanie L. Kwolek Prize（2024）、茅以升科学技术奖-北京青年科技奖（2024），中国石化联合会青年科技突出贡献奖（2023）、青山科技奖(2022)、中国发明协会创新创业一等奖（2023，排名第一）、第48届日内瓦发明展评审团特别嘉许金奖（2023，第一发明人）、英特尔特别贡献奖（2019）、清华大学大学生研究训练计划优秀指导教师特等奖（2022）、清华大学优秀科创指导教师（2022）、清华大学大学生研究训练计划优秀指导教师特等奖（2022）、清华大学优秀科创指导教师（2022）、达摩院青橙最佳潜力奖（2022）、美国材料学会研究生大奖银奖（2017）等。

Chen Wang is tenured track Associate Professor  in Tsinghua University and member of Beijing Advanced Innovation Center for Integrated Circuits. Before joined Tsinghua University, he worked years for Intel Corp, Lam Research in the Bay Area, U.S.A. as senior research engineer for developing advanced logic and memory chips  devices, process and equipment. Before he moved to Bay Area, he got his Ph.D from UCLA. He was awarded Gold Prize with Jury Congratulation of 48th Geneva International Innovation Exhibition (2023), Green Tech Award(2022), Intel Group Recognition Award (2019), MRS GSR Silver Award (2017). His current research focus on fundamental research for post Moore’s era, including emerging semiconductors, novel functional devices, microsystem integrated chips, basic device transportation physics and terahertz photonics. His research results are published in top journals, including Nature, Science, Nature Electronics, Nature Nanotechnology, Science Advances, Chemical Society Reviews, etc with 9000+ citation, and approved/submitted 20+ PCT/China patents. He is board member of National Standard Council of Nanotechnology of China, Chinese American Semiconductor Professional Association(CASPA ), Associate Editor of Frontier in Materials, Micro Nano Letters, Youth Editor board member of SmartMat, Nano Micro Letters, Frontiers in Physics, Journal of Materials Science and Engineering. He was invited speaker or keynote speaker for 10+ international/national conferences, such as CSTIC, MRS, ACS, IEEE NANO, LDMAS, etc.

（1）《SEMICONDUCTOR MATERIALS PROCESSING AND ADVANCED CHIP MANUFACTURING》 （English Classes）开课人与主讲教师，国际研究生，International Graduate Students

（2）《先进芯片材料与制造》为先书院 开课人与主讲教师 Weixian College

（3）《漫步“芯”世界——先进芯片制造探微》开课人与主讲教师，全校学生

（4）《材料化学》未央书院 开课人与主讲教师 Weiyang College

（5）《工科领导力》为先书院 开课团队与主讲教师 Weixian College

（6）《科技与人文》未央书院 主讲教师 Weiyang College

（7）《科技创新与挑战2A》为先书院 课程方向负责人 Weixian College

（8）《微纳材料探索》未央书院 合讲教师 Weiyang College

（9）《未央工程导论》未央书院 合讲教师 Weiyang College

（10）《生产实习》材料学院 合讲教师 School of Materials Science and Engineering

从芯片新材料与后摩尔芯片两个端口，系统开展对新型半导体材料、下一代半导体工艺、新原理高性能器件、多模式集成微系统和新一代芯片开展系统性基础研究和融合性应用研究，打破芯片研究Lab与Fab之间的壁垒，发展具有特色的基于新材料、新原理器件和新工艺的后摩尔芯片研究，具体研究方向包括但不限于：

（1）多尺度调控电子材料的生长机制和大尺度可控工业级制备研究

（2）低维尺度半导体/传统半导体材料的高质量异质结构集成和高阶异质结设计

（3）新型具有综合高效能的异质电子器件设计和器件物理

（4）面向下一代光电芯片和光量子芯片的激子动力学研究和太赫兹光电器件开发

（5）多模式集成环境综合感知芯片和全套技术研究

（6）纳米尺度半导体材料的输运研究和凝聚态物理

（7）纳米尺度柔性光电器件及其在生物传感器和组织电子学应用

（8）功率半导体材料与高性能器件研究

（9）特种半导体工艺开发与半导体设备模组研制

（10）下一代工业级半导体器件的前瞻性研究和器件验证

NEXT Lab research interest is ranging from two ends: innovation chip materials and post Moore era Chips, by systemically researching and developing novel semiconductor materials and process, high performance devices, multi-mode microsystem chips, post Moore era Chips, thus breaking the R&D barrier between Labs and Fabs and promoting world leading novel materials based post Moore era chips fundamental research. Therefore our research directions is included but not limited to:

(1) Multi-dimensional modulation of novel electronic materials synthesis and large scale industrial fabrications

(2) Low dimensional/traditional semiconductor heteregeous integration and high order heterostructures

(3) Advanced high performance heterojunction based devices design and device physics

(4) Exciton dynamics and THz optoelectronic devices development for quantum photonics and quantum chips

(5) Multi-mode integrated universal environmental sensing chips

(6) nanoscale electronic and photonic transpotation and condensed matter physics

(7) Flexible electronics and tissue engineering

(8) power semiconductor and high end devices

(9) advanced 3D packaging technology and wafer level packaging

(10) Pioneering validaiton of next generation industrail devices and chips

作为项目负责人负责10余项国家重点研发计划课题、自然基金委项目、北京市科委重大专项、重点芯片企业专项、佛山先进制造研究院专项、清华大学自主科研计划等核心科研项目

As project leader, responsible for 10+ national, Beijing and key companies's research and development projects

Total Citations: 8600; Annual Citations: 1300; 

Representative Publications: 

(1) Monolayer atomic crystal molecular superlattices, Nature 555, 231-236 (2018) First Author

(2) Lateral epitaxial growth of two-dimensional layered semiconductor heterojunctions, 

Nature Nanotechnology 9, 1024–1030 (2014) Co-first Author

(3) Lateral layered semiconductor multijunctions for novel electronic devices, 

Chemical Society Reviews,51, 4000-4022 (2022), Coressponding Author

(4) Highly Processable wTSV Modular Manufacturing for Next Generation 3D MEMS/NEMS Integrated System, China Semiconductor Technology International Conference (CSTIC), 2022, doi: 10.1109/CSTIC55103.2022.9856850, Coressponding Author